Leading embedded consultancy ByteSnap Design will be showcasing their latest innovation in pipe thickness monitoring technology at the Engineering Design Show in Coventry this October.
The third-generation WAND Handheld Data Collector, developed in collaboration with King’s Award for Innovation winner Inductosense, represents a quantum leap in industrial sensor technology and will be on display at stand H52.
The WAND HDC is a major step forward from ByteSnap’s ELEKTRA 2022 IoT Product of the Year-winning WAND RDC, showcasing the company’s mastery of embedded systems and Inductosense’s patented sensing innovation.
ByteSnap Design has comprehensively redesigned the electronics and core cartridge of the WAND HDC, delivering significant improvements in performance and cost. These include increased operating speeds, extended battery life, enhanced high-speed communications, and an intuitive new user interface – all while meeting the latest IoT cybersecurity requirements.
Director at ByteSnap Design, Dunstan Power, commented, “This project is a testament to the power of British engineering collaboration. By working with Inductosense, who are at the forefront of industrial sensing innovation, we have been able to apply our embedded systems expertise to enhance nearly every aspect of their already exceptional technology. This represents a classic improvement of an existing product using the latest technology to achieve maximum resilience and world-class performance.”
The WAND HDC maintains Inductosense’s core breakthrough of precise, non-invasive pipe wall thickness measurements using patented wireless ultrasonic sensor technology, while delivering the performance upgrades that are essential in today’s industrial environments.
Inductosense’s journey from a University of Bristol research project to winning the King’s Award for Innovation demonstrates the transformative potential of British innovation. With over 40 employees and thousands of WAND sensors deployed globally across sectors including oil & gas, chemical, mining, renewables, and nuclear, the company is now a leader in wireless corrosion monitoring.
ByteSnap Design, one of the UK’s leading embedded electronics consultancies, contributed its award-winning engineering capabilities to this challenging redesign. With expertise in embedded Linux, FPGA development, IoT cybersecurity, and ultra-low power design, the company was instrumental in achieving the performance breakthroughs that define the third-generation device.
Dr. Chenghuan Zhong, founder and Chief Technology Officer at Inductosense, stated, “The collaboration between Inductosense’s first-class sensing innovation and ByteSnap’s embedded engineering mastery has produced something truly exceptional. This third-generation device wouldn’t exist without ByteSnap’s technical excellence in electronics design and its deep understanding of what industrial environments demand.”
The WAND HDC addresses the increasing challenges of industrial asset management, where internal corrosion and erosion pose significant operational risks. Unlike traditional manual inspection methods, the WAND system offers continuous, accurate monitoring that enables predictive maintenance and helps prevent costly unplanned shutdowns.
Experience ByteSnap’s engineering excellence at the Engineering Design Show 2025, where professionals are invited to visit stand H52 to see this exceptional collaboration in action. ByteSnap’s experts will demonstrate how their embedded systems mastery, applied to Inductosense’s innovative sensing technology, is driving the future of industrial IoT.
The WAND HDC represents more than just technological advancement – it showcases how ByteSnap’s engineering excellence helps transform breakthrough innovations into market-leading solutions, solving real-world industrial challenges through collaborative British engineering.
In addition to showcasing their latest innovation, ByteSnap’s Director Dunstan Power will also be speaking at the event on 8 October in a session titled “Breaking the Reactive Cycle: Strategic Approaches to Component Obsolescence Management.” He will also be a panellist on the supply chain forum on 9 October, discussing supply chain security and resilience in the age of tariffs and shifting goalposts.
For more information or to arrange a demonstration at stand H52, contact ByteSnap Design at info@bytesnap.co.uk or visit their website www.bytesnap.com.
About Inductosense
Inductosense, winner of the King’s Award for Innovation, specializes in designing and manufacturing wireless, battery-free ultrasonic sensors that monitor internal corrosion, cracks, and erosion. Founded in 2015 as a spin-out from the University of Bristol, the company now employs 40 people and has thousands of sensors deployed globally. Their technology allows customers to reduce costs and digitalize their corrosion monitoring.
About ByteSnap Design
ByteSnap Design is a leading UK electronics engineering consultancy that develops next-generation technology products for businesses around the world. With over 17 years of experience and award-winning expertise in areas such as embedded Linux, IoT, ATEX & FPGA development, and cybersecurity, ByteSnap Design delivers world-class embedded systems for clients ranging from innovative start-ups to global corporations.
Derick is an experienced reporter having held multiple senior roles for large publishers across Europe. Specialist subjects include small business and financial emerging markets.